3C products, also known as information appliances, generally refer to computer, communication and consumer electronics. There is a large demand in various markets. China has become the world's largest consumer market for 3C products. With the improvement of the national economic level and income level, higher requirements are put forward for the quality of electronic products. Businesses have launched products with higher configuration, higher performance and better design to meet consumers.

There are many factors that affect the quality of electronic products, among which heat dissipation cannot be ignored. Especially after the "Samsung Battery Gate" incident in 2016, electronic manufacturers paid more attention to the heat dissipation performance and safety of products. How can we ensure that the heat dissipation of electronic products meets rigorous design requirements? Planning thermal management issues at the beginning of the product design cycle is the best way to achieve the most efficient cooling solution. Yaofeng Electronics is a first-class heat dissipation technology service provider in China, capable of providing heat dissipation solutions for IT communication electronic products, including board (motherboard) heat dissipation, CPU heat dissipation, graphics card heat dissipation, RF module heat dissipation, RU heat dissipation, game console heat dissipation, VR heat dissipation, industrial computer (computer) heat dissipation, server heat dissipation, central variable frequency air conditioning heat dissipation, TEC heat dissipation, and other fields.